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USM/WJM(Ultrasonic Machining /Water Jet Maching)
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Hocheng,
H. 1990, "A Failure Analysis of Water Jet Drilling in Composite Laminates",
International Journal of Machine Tools & Manufacture, Vol.30, pp.423-429.
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Hocheng, H.
and Chang, K.R., 1994, "Material Removal Analysis in Abrasive Water Jet
Cutting of Ceramic Plates", Journal of Materials Processing Technology,
Vol.43, No.40, pp.287-304.
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Hocheng,
H. and Hsu,.C.C. 1995, "Preliminary Study of Ultrasonics Drilling of
Fiber- Reinforced Plastics", Journal of Materials Processing Technology,
Vol.48, pp.255-266.
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Hocheng,
H., Tsai, H. Y., Shiue, C.C. and Wang, B., 1997, "Feasibility Study of
Abrasive-Water Jet Milling of Fiber-Reinforced Plastics", ASME Trans.
J. Engineering for Industry, Vol.119, pp.133-142.
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Hocheng,
H., Kuo, K.L. and Lin, C.T., 1999, "Machinability of Ultrasonic Drilling
of Zerconia", Materials and Manufacturing Processes, Vol.14, No.5, pp.713-724.
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Hocheng,
H., Tai, N.H. and Liu, C.H., 2000, "Assessment of Ultrasonic Drilling
of C/SiC Composite Material", Composites, Part A, Vol.31, No.2, pp.133-142.
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Hocheng,
H. and Hsu, M.Y., 2000,"Erosion Wear of Stainless Steel by Abrasives
Entrained in a Water Jet", Arabian Journal for Science and Engineering,
Vol.25, No.1B, pp. 189-202.
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Jeng, F.S.,
Huang, T.H., Lu, Y.C. and Hocheng, H., 2001,"Threshold Condition for
Penetrating Rocks Using High Pressure Waterjet", Journal of Civil and
Hydraulic Engineering, Vol 13, No 3, pp.677-681.
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Hocheng, H. and Kuo, K.L.,
2002, "On-Line Tool Wear Monitoring during Ultrasonic Machining Using
Tool Resonance Frequency", Journal Materials Processing Technology, Vol
123, No.1, pp. 80-84.
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Hocheng,
H. and Kuo, K.L., 2002, "Fundamental Study of Ultrasonic Polishing of
Mold
Steel", International Journal of Machine Tools and Manufacture, Vol 42/1,
pp.7-13.
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Hocheng,
H. and Weng, C.H., 2002, "Hydraulic Erosion of Concrete by a Submerged
Jet", ASM Trans. J. of Materials Engineering and Performance, Vol 11,
No 3, pp.256-261.
Laser Machining
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Hocheng, H.
and Pan,C.T., 1996, "The Anisotropic Heat Affected Zone in Laser Grooving
of Fiber-Reinforced Composite Material", Journal of Materials Processing
Technology, Vol. 62/1-3, pp.54-60.
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Pan, C.T. and Hocheng, H.,
1998, "Prediction of Extent of Heat Affected Zone in Laser Grooving of
Unidirectionally Fiber-Reinforced Plastics", ASME Trans. J. of Engineering
Materials and Technology, Vol.120, pp.321-327.
- Hocheng, H. and Pan, C.T., 1998, "Prediction of Laser-Induced Thermal
Damage of Fiber Mat and Fiber MatUD-Reinforced Polymers", ASM Trans.
J. of Materials Engineering and Performance, Vol.7, No.6, pp.751-756.
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Uhlmann,
E., Spur, G., Hocheng, H., Liebelt, S. and Pan, C.T., 1999, "The Extent
of Laser-Induced Thermal Damage of Fiber UD and Cross-ply Composite Laminates",
International Journal of Machine Tools & Manufacture, Vol.39, No.4, pp.639-650.
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Hocheng,
H. and Pan, C.T., 1999, "The Effects of Cryogenic Surroundings on Thermal
Induced Damage in Laser Grooving of Fiber-Reinforced Plastics", Journal
of Machining Science and Technology, Vol.3, pp.77-90.
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Pan, C.T.
and Hocheng, H., 2001, "Evaluation of Anistropic Thermal Conductivity
for Unidirectional Fiber-Reinforced Plastics in Laser Machining of Unidirectionally
Fiber- Reinforced Plastics", Composites, Part A, Vol.32, No.11, pp.1657-1667.
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Hocheng,
H. and Wang, K.Y., 2008, "Microgroove Pattern Machined by Excimer Laser
Dragging", International Journal of Manufacturing Technology and Management,
Vol.13, No.2/3/4, pp.241-253.
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Hocheng,
H., and Wang, K.Y., 2007, “Analysis and Fabrication of Mini-feature Lamp Lens
by Excimer Laser Micromachining”, Applied Optics, Vol. 46, pp. 7184-7189.
EDM(Electrical Discharge Machining)
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Hocheng,
H., Lei, W.T. and Hsu, H.H., 1997, "Preliminary Study of Material Removal
in Electrical-Discharge Machining of SiC/Al", Journal of Materials Processing
Technology, Vol. 63, pp.813-818.
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Guu, Y.H.
and Hocheng, H., 2001,"Effects of Workpiece Rotation on Machinability
during Electrical Discharge Machining", Materials and Manufacturing Processes,
Vol.16, No.1, pp.91-101.
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Hocheng,
H., Guu, Y.H. and Tai, N.H. 1998, "The Feasibility Analysis of Electrical
Discharge Machining of Carbon-Carbon Composite Materials", Materials
and Manufacturing Processes, Vol.13, pp.117-132.
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Guu, Y.H., Hocheng, H., Tai,
N.H. and Liu, S.Y., 2001, "Effects of Electrical Discharge Machining
on Characteristics of Carbon-Fiber Reinforced Carbon Composites", Journal
of Materials Science, Vol 36, pp.2037-2043.
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Hocheng, H. and Guu, Y.H.,
2001,"High-Cycle Fatigue of Electrical-Discharge Machined AISI D-2 Steel",
International Journal of Materials and Product Technology, Vol 16, No 6/7,
pp.642-657.
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Guu, Y.H. and Hocheng, H.,
2001,"Improvement of Fatigue Life of Electrical Discharge Machined AISI
D2 Tool Steel by TiN Coating", Journal of Material Science and Engineering,
Vol A318, pp.155-162.
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Guu, Y.H., Hocheng, H., Chou,
C.Y. and Deng, C.S., 2003,"Effect of Electrical Discharge Machining on
Surface Characteristics and Machining Damage of AISI D2 Tool Steel",
Journal of Material Science and Engineering, Vol A358, pp.37-43.
EP/ECM (Electrochemical Polishing/ Electrochemical
Machining)
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Hocheng, H., Kuo, C. L. and
Wei, S.W., 1999, "Electropolishing of a Spherical Surface and the Application
of Fuzzy Inference", International Journal Electrical Machining, Vol.4,
pp.19-28.
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Hocheng, H. and Pa, P.S., 1999,
"Electrobrightening and Electropolishing of Holes Using Feeding Electrodes",
Journal of Material Processing Technology, Vol. 89/90, pp.434-446.
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Hocheng, H. and Pa, P.S.,
2000, "Ring-Form Electrode in Electropolishing of External Cylindrical
Surface", International Journal of Electrical Machining, Vol.5, pp.7-15.
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Hocheng, H. and Pa, P.S.,
2001, "Electrode Form Design and Ultrasonic Aid in Electropolishing of
Holes", International Journal of Electrical Machining, pp.33-39.
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Hocheng, H., Gao, P.S. and
Chen, Y.F., 2001, "Electropolishing of of 316L Stainless Steel for Anticorrosion
Passivation ", ASM Trans. J. of Materials Engineering and Performance,
Vol 10, No 4, pp.414-418.
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Hocheng, H. and Pa, P.S.,
2002, "Application of Turning Tool as Electrode in Electropolishing,
Journal of Materials Processing Technology, Vol.120, pp.6-12.
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Hocheng, H. and Pa, P.S.
2003, "Effective Form Design of Electrode in Electrochemical Smoothing
of Holes", International Journal of Advanced Manufacturing Technology,
Vol.21, No.12, pp. 995-1004.
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Hocheng, H., Y.H. Sun, S.C.
Lin and P.S.Gao, 2003, "A Material Removal Analysis of Electrochemical
Machining Using Flat-End Electrode", Journal of Materials Processing
Technology, Vol. 140, pp. 264-268.
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Hocheng, H. and Pa, P.S.,
2003, "Continuous Secondary Ultrasonic Electropolishing of SKD61 Cylindrical
Part", International Journal of Advanced Manufacturing Technology, Vol.21,
No.4, pp.238-242
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Hocheng, H. and Gao, P.S.,
2003, "Optimization of Electropolishing of Stainess Steel by Gray Relational
Analysis", Journal of Materials Processing Technology, Vol. 140, pp.
255-259.
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Hocheng, H. and Pa, P.S.,
2003, "Electropolishing of Cylindrical Workpiece of Tool Materials Using
Disc-Form Electrodes", Journal Materials Processing Technology, Vol.142,
No.1, pp.203-212.
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Hocheng, H. and Pa, P.S.,
2004, "Design of Arrow-Head Electrode in Electropolishing of Cylindrical
Part", International Journal of Materials and Product Technology, Vol.20,
No.4, pp.312-326.
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Hocheng, H., P.S.Gao and
Lin, S.C., 2005, "Generation of Erosion Profile of Through Hole in Electrochemical
Boring Using Stepwise Moving Electrode", International Journal of Manufacturing
Technology and Management, Vol.7, No.2-4, pp.268-286.
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Hocheng, H., Gao, P.S. and
Lin, S.C., 2005, "Development of the Eroded Opening during Electrochemical
Boring of Hole", International Journal of Advanced Manufacturing Technology,
Vol. 25, No. 11/12, pp. 1105 – 1112.
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Pa, P.S. and Hocheng, H.,
2005, "Using Borer-Shape Electrode in Electrochemical Smoothing of Hole",
Material Science Forum, Vols.505-507, pp.793-798.
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Pa, P.S. and Hocheng, H.,
2007, "Design of Rib Plate of Electrode in Electrochemical Smoothing
and Electrobrightening of Large Hole", International Journal of Advanced
Manufacturing Technology, Vol.34, No.5-6, pp.517-526.
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Hocheng, H and Pa, P.S.,
2007, "A Review of Electrode Design for Electrochemical Drilling and
Electropolishing of Holes", Current Topics in Electrochemistry, Vol.12,
pp.33-49.
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CMP (Chemical Mechanical Planarization/Polishing)
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Hocheng, H., Huang, Y. L.
and Chen, L.J., 1999, "Kinematic Analysis and Measurement of Temperature
Rise on Pad in CMP", Journal of the Electrochemical Society, Vol.146,
No.11, pp.4236-4239.
- Hocheng, H. and Tsai, H.Y., 1999, "A Material Removal Model in Chemical
Mechanical Planarization of Silicon Dioxide Film and Bare Silicon Wafer",
International Journal of Chemical Mechanical Planarization, Vol.1, No.1, pp.90-101.
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Hocheng, H., Tsai, H.Y. and
Tsai, M.S., 2000, "Effects of Kinematic Variables on Nonuniformity in
Chemical Mechanical Planarization", International Journal of Machine
Tools & Manufacture, Vol.40, pp.1651-1669.
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Hocheng, H., Tsai, H.Y. and
Huang, Y.L., 2001, "Essential Aspects in Chemical Mechanical Planarization
of Dioxide Semiconductor", Key Engineering Materials, pp.1-24, Trans
Tech, Switzerland.
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Hocheng, H., Tsai, H.Y. and
Su, Y.T., 2001, "Modeling and Experimental Analysis of Material Removal
Rate in Chemical Mechanical Planarization of Silicon Dielectric Films and
Bare Silicon Wafer", Journal of the Electrochemical Society, Vol.148,
No.10, pp.G581-586.
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Hocheng, H. and Cheng, C.Y.,
2002, "Visualized Characterization of Fluid Film Between Wafer and Pad
during Chemical Mechanical Planarization", IEEE Trans. Semiconductor
Manufacturing, Vol.15, No.1, pp.45-50.
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Hocheng, H. and Huang, Y.L.,
2003, “A Comprehensive Review of Endpoint Detection in Chemical Mechanical
Planarization for Deep-Submicron Integrated Circuits Manufacturing”, International
Journal of Materials and Product Technology, Vol 18 No. 4/5, pp.469-486.
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Hocheng, H. and Huang, Y.L.,
2004, “In-Situ Endpoint Detection by Pad Temperature in Chemical Mechanical
Polishing of Copper Overlay”, IEEE Trans. Semiconductor Manufacturing, Vol.
17, No. 2, pp.180-187.
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Hocheng, H. and Chen, C.C.,
2005, “A Study of the Chemical-Assisted Mechanical Polishing of CVD Diamond
Film", Special Issue of Materials Science Forum, Vols.505-507, pp.1225-1230.
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Wang, C.C., Lin, S.C. and
Hocheng, H., 2002, “A Material Removal Model for Polishing Glass-Ceramic and
Aluminum Magnesium Storage Disk”, International Journal of Machine Tools and
Manufacture, Vol.42, pp.979-984.
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Chen, S.Y., Lin, S.C. and
Hocheng, H, 2005, “Polishing Glass-ceramic Based Rigid Disk”, Material Science
Forum, Vols.505-507, pp.1213-1218.
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S. C. Lin, H. C. Huang, and
H. Hocheng, 2005, “Effects of Slurry Components on the Surface Characteristics
when Chemical Mechanical Polishing NiP/Al Substrate”, Thin Solid Film, Vol.483/1-2,
pp.400-406.
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Lin, J.B., Lin, S.C., Hocheng,
H., 2005, “A Simulation Approach of Dishing in Chemical Mechanical Polishing
of Inlaid Copper Structures ”, Journal of the Electrochemical Society, Vol.
152, pp. 664-668.
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Hocheng, H. and Huang, Y.L.,
2007, “In-situ Endpoint Monitoring by Acoustic Emissions in Chemical Mechanical
Polishing of Metal Overlay”, IEEE Trans. Semiconductor Manufacturing, Vol.
20, No. 3, pp.306-312.
Nanoimprint
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Hocheng, H. and Nien, C.C.,
2006, "Numerical Analysis of Effects of Mold Feature and Contact Friction
on Cavity Filling in Nanoimprinting Process", Journal of Microfabrication,
Microlithography, and Micromachining, Vol.5, No.1, pp.011004-1-7.
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Hocheng, H., and Nien, C.C.,
2006, “In-situ Monitoring of Cavity Filling in Nanoimprint by Capacitance”,
The Japanese Journal of Applied Physics, Vol.45, No.6B, pp.5590-5596.
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Hocheng, H. and Nien, C.C.,
2007, "A Review of Monitoring for Nanoimprinting", Journal of Achievements
in Materials and Manufacturing Engineering celebrating the 60th birthday of
Prof. Leszek A. Dobrzanski, Vol.24, No.1, pp.382-389.
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Hocheng, H., and Hsu, W.S.,
2007, “Effects of Back Grooves on Improving Uniformity in Nanoimprint Lithography”,
The Japanese Journal of Applied Physics, Vol.46, 9B, pp.6370-6372.
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Hocheng, H., Wen, T.T. and
Yang, S.Y., 2008, “Replication of Microlens Arrays by Gas-Assisted Hot Embossing”,
Materials and Manufacturing Processes, Vol. 23, pp.261-268.
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Hocheng, H. and Wen, T.T.,
2008, “Electromagnetic Force-Assisted Imprint Technology for Fabrication of
Submicron-Structure”, Microelectronic Engineering, Vol. 85, pp. 1652-1657.
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Hocheng, H. and Hsu, W.S.,
2009, “An Innovative Method for Uniform Pattern Transfer in Nanoimprint”,
Journal of NanoScience and NanoTechnology. (in press)
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Hocheng, H. and Wen, T.T.,
2009, “Innovative Rapid Replication of Microlens Arrays using Electromagnetic
Force-assisted UV-imprinting”, Journal of Micromechanics and Microengineering.
(accepted)
Micro-Device
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Hocheng, H., Pan, C.T. and
Cheng, C.C., 2003, “Formation of Micro-Lens by Reflow of Dual Photoresist”,
The Japanese Journal of Applied Physics, Vol.42, No.6B, pp.4044-4047.
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Hocheng, H., Kao, K.S. and
Fang, W.L., 2004, “Fatigue Life of a Microcantilever Beam in Bending”, Journal
of Vacuum Science Technology B: Microelectronics and Nanometer Structures,
Vol. 22, No.6, pp.3143-3146. and Virtual Journal of Nanoscale Science &
Technology, Vol. 10, No. 26, doi:10.1116/1.1821502. (publication selected
by this journal from JVST: 23 papers out of 148)
- Lin, Y.C., Hocheng, H., Fang, W.L. and Chen, R., 2006, "Fabrication
and Fatigue Testing of an Electrostatically Driven Microcantilever Beam",
Materials and Manufacturing Processes, Vol.21, No.1, pp.75-80.
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Guu, Y.H., Hocheng, H. and
Chang, C.H., 2008, “Study of Piezoelectrically Actuated Micropumps with Multi
Parallel Chambers”, Materials and Manufacturing Processes, Vol. 23, pp.1-6.
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Hocheng, H., Hung, J.N. and
Guu, Y.H., 2008, "Various Fatigue Testing of Polysilicon Microcantilever
Beam in Bending", The Japanese Journal of Applied Physics, Vol.47, pp.5256-5261.
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Hocheng, H., and Tseng, C.,
2008, “Mechanical and Optical Design for Assembly of Vascular Endothelial
Cells Using Laser Guidance and Tweezers”, Optics Communications, Vol. 281,
pp. 4435-4441.
Biomachining/Microbe-based Patterning
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Chang, J.H., Hocheng, H.,
Chang, H.Y. and Shih, A., 2008, “Metal Removal Rate of Thiobacillus Thiooxidans
without Pre-secreted Metabolite”, Journal of Materials Processing Technology,
Vol 201/1-3, pp. 560-564.
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Hocheng, H., Wang, J.C. Chang,
J.H. and Shen, W.C., 2009, “Laser-guided Pattern Writing through Thiobacillus
Ferrooxidans Metabolite”, Microelectronic Engineering. (in press)
- Chang, J.H., Hocheng, H., Chang, H.Y. and Shih, A., 2009, “Metal Removal
Behavior of Acidithiobacillus Ferrooxidans”, Journal of Materials Processing
Technology. (in press).
Others
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Hocheng, H., 1995, "Critical
Matrix Yielding Stress and Interfacial Fracture in Forming of Metal Matrix
Composite Wires", JSME International Journal, Vol.38, No.4, pp.625-630.
- Hocheng, H. and Chen, H.C., 1996, "Mechanical Design Major Components
of the Single Pole Carriage in <<Khao Kung Chi>>",Tsing Hua
Journal of Chinese Studies, Vol.25, No.1, pp.419-450.
- Tai, N.H., Lee, K.P., Hocheng, H., Liu, C.S., 1999, “Processing and Characterization
of Carbon Fiber Reinforced Ceramic Nanocomposites”, Key Engineering Materials,
Vol. 164-165, pp. 105-108.
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Chang, Y. and Hocheng, H.,
2001, "Flowability of Bentonite Bonded Green Molding Sand", Journal
of Materials Processing Technology, Vol 113, pp. 238-244.
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